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Mini-Mac Applicator for Board-In Crimp Terminals
● Wire Hold Down Assembly
The wire hold down spring is assembled onto the outside diameter of the conductor bushing.
The location of the spring on the outside diameter of the bushing should be flush with the bushings surface edge
as shown. There is a clearance groove provided on the punches for the spring to fit between. See Figure 3.
INSULATION
BUSHING
CONDUCTOR
BUSHING
CONDUCTOR
PUNCH
HOLD DOWN
GROOVE IN
PUNCHES
NOTES
INSULATION
PUNCH
SPRING
Figure 3
HOLD DOWN
SPRING
1. Molex recommends an extra perishable tooling kit be maintained at your facility.
2. Verify tooling alignment by manually cycling the press and applicator before crimping under power. Check that
all screws are tight.
3. Slugs, terminals, dirt, and oil should be kept clear of work area.
4. Wear safety glasses at all times.
5. For recommended maintenance refer to the Mini-Mac Manual.
CAUTION : This applicator should only be used in a press with a shut height of 135.80 mm (5.346”). Tooling
damage could result at a lower setting
CAUTION : To prevent injury, never operate this applicator without the guards supplied with the press or wire-
processing machine in place. Reference the press or wire processing manufacturer’s instruction manual.
CAUTION : Molex crimp specifications are valid only when used with Molex terminals, applicators and tooling.
Contact Information
For more information on Molex application tooling please contact Molex at 1-800-786-6539.
Visit our Web site at http://www.molex.com
Doc No: ATS-638934300
Revision: D
Release Date: 02-22-07
Revision Date: 09-23-13
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